Dates: November 11to 13, 2009

Venue: JAL Resort Sea Hawk Hotel Fukuoka, Fukuoka, Japan

Organized by (plan):
MAP2009 Organizing Committee
Asia Semiconductor Trading Support Association (ASTSA)
Japan External Trade Organization (JETRO)
Kyushu Semiconductor Industries & Technology Innovation Association (SIIQ)
Fukuoka Prefecture
City of Fukuoka
City of Kitakyushu
Fukuoka Industry, Science & Technology Foundation (Fukuoka IST)
Kyushu Economy International (KEI)
Kyushu Economic Research Center (KERC)

For more details, see the brochure(PDF), please.

We will tell you about the details of the place or registration.

1.the place for technical presentation
JAL Resort Sea Hawk Hotel Fukuoka, 1st floor

2.the place for poster exhibition
JAL Resort Sea Hawk Hotel Fukuoka, 1st floor

3.Registration
JAL Resort Sea Hawk Hotel Fukuoka, 1st floor
We set the registration desk.
*1: We will hand over booklets of abstracts in exchange with your two name cards.
*2:To participants who haven't finished payment of registration fee, we may confirm the way of payment. Cash will be accepted in the period of MAP2008.
*3:We will start registration at 9:00 AM.

4.the place for reception party ( Wednesday, November 26th)
JAL Resort Sea Hawk Hotel Fukuoka, 5th floor, TINGA TINGA

5.the place for poster session with wine (Thursday, November 27th)
JAL Resort Sea Hawk Hotel Fukuoka, 1st floor

Since the program of technical presentation is fixed, we will show you the details.
You can see the PDF file.

Please make a on-line registration.

◇The program of technical presentations◇

Thursday 26th, November

12:30 ~ 13:00 Signing Ceremony of Memorandum of Understanding
between ASTSA & ISA

13:00 ~ 13:05 Opening Remark
Hajime Tomokage
Fukuoka University (JAPAN)

13:05 ~ 14:25 Session 1: Invited Talks
13:05 ~ 13:35 1-1 Current and Future Strategy of Indian Semiconductor Industry
Poornima Shenoy
India Semiconductor Association (ISA) (INDIA)
13:35 ~ 14:05 1-2 How Asia ICT Industry Has Transformed : During the Period of Financial Crisis
Colley Hwang
DigiTimes Inc. (TAIWAN)
14:05 ~ 14:25 1-3 Why the profitability of Japan's Major Electric Manufacturers is so Low and Where are
They Going? - The Prospect for the Upcoming Restructuring.
Fumiaki Sato
Merrill Lynch Japan Securities Co., Ltd. (JAPAN)

14:25 ~ 15:00 Coffee Break

15:00 ~ 18:00 Session 2: 3D Integration
(Knowledge Cluster Initiative (The 2nd Stage) Expansion Program, The 4th Workshop)
15:00 ~ 15:30 2-1 Fabrication and Reliability Issues for Through Silicon Via Technologies
Peter Ramm
Fraunhofer IZM (GERMANY)
15:30 ~ 16:00 2-2 Ad-STAC and ITRI`s 3DIC Update
Wei-Chung Lo
Industrial Technology Research Institute (ITRI) (TAIWAN)

16:00 ~ 16:20 Coffee Break

16:20 ~ 16:40 2-3 Development and Production Status on TSV and CoC in Japan
Hirohisa Matsuki
Fujitsu Microelectronics Limited (JAPAN)
Japan Electronics and Information Technology Industries Association (JEITA) (JAPAN)
16:40 ~ 17:00 2-4 Package Warpage at Elevated Temperature
Hirofumi Nakajima
NEC Electronics Corporation (JAPAN)
Japan Electronics and Information Technology Industries Association (JEITA) (JAPAN)
17:00 ~ 17:20 2-5 Google Aided SiP Design Review
Hiroshi Murata
GEM Design Technologies, Inc. (JAPAN)
17:20 ~ 17:40 2-6 Renesas SiP Future 3D Technology
Masashi Umino
RENESAS Technology Corporation. (JAPAN)
17:40 ~ 18:00 2-7 InterViaTM Photodielectric
Wataru Tachikawa
Rohm and Haas Electronic Materials K.K. (JAPAN)

18:00 ~ 18:30 Coffee Break

18:30 ~ 20:00 Reception Party

Thursday 27th, November

09:00 ~ 12:10 Session 3: Green Devices
09:00 ~ 09:30 3-1 Photovoltaic Industry Activities in Korea
Donghan Kim
Korea University (KOREA)
09:30 ~ 10:00 3-2 Introduction to Processes and Prospects of CIGS and Organic Thin Film Solar Cells
Keiichiro Sakurai, Tetsuya Taima
National Institute of Advanced Industrial Science and Technology (AIST) (JAPAN)
10:00 ~ 10:30 3-3 Investment Opportunities in the Solar Industry in Malaysia
Zabidi Mahbar
Malaysian Industrial Development Authority (MIDA) (MALAYSIA)

10:30 ~ 10:40 Coffee Break

10:40 ~ 11:10 3-4 High Bright White LED Packaging Technology and It’s Applications
Atsushi Okuno
Sanyu Rec Co., Ltd. (JAPAN)
11:10 ~ 11:40 3-5 Sapphire and Diamond R&D of Namiki
Kazuhiko Sunagawa
Namki Precision Jewel Co., Ltd. (JAPAN)

11:40 ~ 12:10 3-6 Investment Opportunities in the Solar Industry in Malaysia
Tomomi Yamaguchi
Toshiba Cooperation (JAPAN)

12:10 ~ 13:00 Lunch Break

13:00 ~ 15:50 Session 4: Semiconductor Testing Solution
13:00 ~ 13:20 4-1 Business Model & New Probing Technology
Masahide Ozawa
Tera Probe, Inc. (JAPAN)
13:20 ~ 13:40 4-2 KYEC’s Japan Market Strategy - King Yuan Electronics Co., LTD. (KYEC)
Toshio Sugano
King Yuan Electronics Co., Ltd. (TAIWAN)
13:40 ~ 14:00 4-3 Yokogawa Electric Corporation SoC Tester Strategy
Hirokazu Oooka
Yokogawa Electric Corporation (JAPAN)
14:00 ~ 14:20 4-4 Silicon Netlist to High Volume Production - Opportunities for Time to Market
P. Raj Manickam
Tessolve (INDIA)

14:20 ~ 14:30 Coffee Break

14:30 ~ 14:50 4-5 Chip Defects Inspection System for CIS／MEMS／Flip Chip／Wafer Level CSP
Toshiyuki Yasuda
TOPCON Corporation (JAPAN)
14:50 ~ 15:10 4-6 Chip Test – Semiconductor IC Test Services
M. Sankara
ChipTest Labs Ltd. (INDIA)
15:10 ~ 15:30 4-7 Image Sensor Testing - How to Test for CIS/CCD
Yuji Nakamura
ALDETE Corporation (JAPAN)
15:30 ~ 15:50 4-8 Leadless Molded Packaging
T.Paul Ilanghovan
SPEL Semiconductor Limited. (INDIA)

15:50 ~ 16:05 Coffee Break

16:05 ~ 17:05 Session 5: Design tool and Design Business
16:05 ~ 16:25 5-1 EDA tools for Analog/Mixed-Signal IC and MEMS Layout Design for Circuit Design,
Layout Design and Layout Verification
Yoshiko Shimogaki
Tanner Research Japan K.K. (JAPAN)
16:25 ~ 16:45 5-2 Offshore Outsourcing of LSI Design & Software Development
Joby Joseph V.
Network Systems & Technologies Pte Ltd. (INDIA)
16:45 ~ 17:05 5-3 A Unique 'In-sourcing' Business Model for Offshore Chip-Design and Software
Development Centres
Bala Dhandayuthapani Pachyappa
Auxineon Pte Ltd. (SINGAPORE)

17:05 ~ 17:20 Coffee Break

17:20 ~ 19:00 Session 6: Equipment and Parts
17:20 ~ 17:40 6-1 Molecular Modification of PCB Substrates for Fine Line Patterning: Demonstration of
High Peel Strength, Low Surface Roughness and HAST Survivability of Molecular
Modified Surfaces
Werner Kuhr, Ph.D.
Zetta Core.Inc. (U.S.A.)
17:40 ~ 18:00 6-2 Micro Contact Applied Semiconductor Socket
Shin Yoshida
Alps Electric Co., Ltd. (JAPAN)
18:00 ~ 18:20 6-3 Making Equipment Manufactures More Competitive in the Global Market – the
Introduction of “Monozukuri” at Kitahara Welltec
Kitahara Nobu
Kitahara Welltec, Inc. (JAPAN)
18:20 ~ 18:40 6-4 Factory Automation & Productivity Enhancement
Keiji Matsumoto
Daiichi Institution Industry Co., Ltd. (JAPAN)
18:40 ~ 19:00 6-5 Assembly of Electronics without Solder - Technical Dream or Vision of the Future? Joseph Fjelstad
Verdant Electronics – Silicon Pipe (U.S.A.)

19:00 ~ 20:30 Session 7: Poster Session with Wines
7-1 Electro polishing of Copper for Planarization of TSV in 3D SiP
Jae-ho Lee
Hongik University (KOREA)

Venue: JAL Resort Sea Hawk Hotel Fukuoka, Fukuoka, Japan

Organized by (plan):
MAP&RTS2007 Organizing Committee
Asia Semiconductor Trading Support Association (ASTSA)
Japan External Trade Organization (JETRO)
Kyushu Semiconductor Industries & Technology Innovation Association (SIIQ)
Fukuoka Prefecture
City of Fukuoka
City of Kitakyushu
Fukuoka Industry, Science & Technology Foundation (Fukuoka IST)
Kyushu Economy International (KEI)
Kyushu Economic Research Center (KERC)

For more details, see the brochure(PDF), please.

*Networking with Indian semiconductor companies
*Analyst shows a scenario of reorganizing semiconductor business
*Green device (solar cell, LED and power device)
*Latest 3D assembling technologies (Fraunhofer IZM, ITRI and IDM)
*Access to the database of 850 semicondutor companies
*Excursion (NEC and Tera Probe in Kumamoto Pref.) in order of request, 30 people

For more details see the latest flyer (PDF)
http://astsa.jp/upload/2008/10/200810281920552.pdf

Online Registration
http://astsa.jp/navi_e_guide.php

Poster Exhibition
●Poster Exhibition and Business Meeting

Reception Party

Thu, November 27, 2008
AM-PM
Presentation
●Business Presentation
●Technical Presentation

Poster Exhibition
●Poster Exhibition and Business Meeting

Poster Session with Wine

Fri, November 28, 2008
AM-PM
Excursion
(Semiconductor Companies in Kyushu)

Topics to be discussed are
■Next to Foundry Business
■Indian Semiconductor Trend
■MEMS and Sensor Devices
■Three Dimensional Packaging Technology
■Device-Embedded Substrate
■Design for Manufacturability
■Solar Cell Packaging
■Eco Device and Environment-Friendly Materials

For more details, see the brochure(PDF), please.

●FAX●

The "Registration and Application"form is attached at the end of brochure or online by accessing this page.
You can download the form(PDF) online.

Registration and Application form (English)

Fax number is : +81-92-722-6205

1. MAP2008 Participation
The Registration Fee is 30,000yen per person and includes:
A booklet of Technical Abstracts from all the sessions
Access to a database of over 600 IC related companies in English and Japanese
Entrance to the reception
Excursion of the Semiconductor company in Kitakyushu.(Participants will be selected by registration on a first-come-first-serve basis.Application to excursion is closed.)

The deadline for registration isNovember 25, 2008.

2. Technical Presentation
Participants are welcome to make 15-20 min presentation in English which should be accompanied by 1 page abstract to be submitted by October 17,2008. There will be no additional fee other than the 30,000yen participation fee. The deadline for registration of technical presentation is October 24, 2008.

3. Poster Exhibition
For participants who wish to promote their products through the poster exhibition, a 1.5m x 2m panel will be supplied and the fee will be 98,000yen which includes the participation fee for 1 participant.
The deadline for application is October 31, 2008.

For more details on accommodation reservations, please contact directly the hotel.

Here you can see an Accomodation Form on JAL Resort Sea Hawk Hotel Fukuoka.

JAL Resort Sea Hawk Hotel Fukuoka,
Person In Charge: Mr. Iwase
TEL:+81-92-844-7902, FAX:+81-92-844-7743
e-mail:iwase-tatsuro@hawkstown.jp

You can mail to: 1-9-48 Daimyo, Chuo-ku, Fukuoka, 810-0041 JAPAN
Kyushu Economic Research Center
Y.Nakagawa, E.Hirata and H.Okano

You can email to: MAP@astsa.jp

The Deadline is October 17, 2008.

Please follow these guides when you write your abstract.

- Font and size.....................Times New Roman 12 points
- Paper size ..........................A4
- Length .................................No more than 2 pages

Here is the sample format of an abstract. It does not have to be exactly this way, but it will be help us when we edit the abstracts.

We will show you the results of MAP&RTS2007 as follows.

RESULTS

◆MAP◆
participants: 448 （from abroad 85）
China 37, Korea 26, Taiwan 6, Malaysia 5,
U.S. 5, HongKong 4, Singapore 2

presentations: 36 （from abroad 12）
Korea 6, Taiwan 2, U.S. 2, China 1,
Singapore 1

◆RTS◆
exhibitors: 45 (from abroad 8)
Korea 5, U.S. 1, China 1, Malaysia 1

Venue: West Japan General Exhibition Center, Kitakyushu, Japan

Organizers:
MAP&RTS2007 Organizing Committee
Asia Semiconductor Trading Support Association (ASTSA)
Japan External Trade Organization (JETRO)
Fukuoka Prefecture
City of Fukuoka
City of Kitakyushu
Fukuoka Industry, Science & Technology Foundation (Fukuoka IST)
Promotion Council of Northan Kyushu Science Cities' Development Plan
Kyushu Economy International (KEI)
Kyushu Economic Research Center (KERC)

For more details, see the brochure(PDF), please.

You can see the PDF file.

●Wednesday, 10 October, 2007
Presentation
12：00～　Registration starts
13：00～13：10　Opening Remarks
Hajime Tomokage
Professor, Dept.of Electronics Engr & Computer Sci., Fukuoka University

13：10～14：40　Session1 Invited Talks
Chair : Eddie Ohtsuru (Fukuoka Industry, Science & Technology Foundation)
13:10～13:40 1.1 A short introduction about the status of semiconductor industries in northern China
Zhihua WANG
Institute of microelectronics, Tsinghua University (CHINA)
13:40～14:10 1.2 Development of Evaluation Software for System LSI Collaborating with Chinese University
Hirokazu Tanaka
Hokkaido University (JAPAN)
14:10～14:40 1.3 Tera Probe, new test business partner as value added solution provider
Masahide Ozawa
Tera Probe ,Inc. (JAPAN)

14:40～15:00 COFFEE BREAK

15：00～16：00　Session2 JEITA Program
Chair:Fumiaki Shigeoka (Ueno Seiki Co., Ltd.)

15:00～15:30 2.1 Mobile Products Trend and Requirement to Semiconductor Package
Hiroshi Manita
Casio Computer Co., LTD. (JAPAN)
15:30～16:00 2.2 Challenges of Semiconductor Packaging Technologies to meet the Requirements from Electronics Products -From Japan Jisso Technology Roadmap 2007-
Shoji Uegaki
ASE Marketing & Service Japan Co., Ltd (JAPAN)

16：20～18：00　Session3 ICT Symposium
-Technology for Next Generation Electric Vehicle-
Chair : Hajime Tomokage (Fukuoka University)

16:20～17:00 3.1 Concept and Technology of Next Generation Electric Vehicle (Eliica)
Hiroshi Shimizu
Keio University (JAPAN)
17:00～17:20 3.2 Future Personal Mobility "i-unit"
Makoto Morita
TOYOTA MOTOR CORPORATION (JAPAN)
17:20～17:40 3.3 Technological Requirements for Electric Vehicles and Kyushu
Electric’s Efforts for Their Promotion
S. Murakami,
Kyushu Electric Power Co., Inc. (JAPAN)
17:40～18:00 3.4 Trends for Car Electronics Market and Testing Equipment
Yasunori Yamaguchi
TERADYNE (JAPAN)

18：30～20：30　Reception Party　（AIM　3rd floor　Flamingo Cafe）

●Thursday, 11 October, 2007
Presentation
09：00～10：15　Session4 Design for Manufacturability
Chair : Joseph Fjelstad (Sillicon Pipe,Inc.)

09:00～09:15 4.1 Jisso technology trends – Why DFM is necessary ?
Kazunori Kato
Advanced Interface Technology Corp. (JAPAN)
09:15～09:30 4.2 DFM System for Final Manufacturing of LSI
Andres Carrasco
Nagase Electronic Equipment Service Co., Ltd. (JAPAN)
09:30～09:45 4.3 An Integrated Design & Analysis Solution for Advanced IC Package
and System-in-Package (SiP) Design
Dave DeMaria
Optimal Corp. (U.S.A.)
09:45～10:00 4.4 Practical Use of Package Virtual Design System (PVDS) in Spansion
Naomi Masuda, Ryota Fukuyama, Kouichi Meguro, Junichi Kasai
Spansion Japan Limited (JAPAN)
10:00～10:15 4.5 Ideal DFM for backend business in Japanese LSI industry
Ichiro Anjo
Akita Elpida Memory Inc. (JAPAN)

10:15～10:35 COFFEE BREAK

10：35～12：20　Session5 Tool, Test and Business Proposal
Chair : Todd Takaki (Inoueki Co.,Ltd.)

10:35～10:50 5.1 EDA Tool for IC Packaging with Three Dimensions Database
Hiroyuki Kataoka, Hidemichi Kawase* and Hajime Tomokage**
HIBIKINO SYSTEM-LAB INC. ,*Keirex Technology and
**Fukuoka University (JAPAN)
10:50～11:05 5.2 Tool’s of Semiconductor
K.H.Cheon
EPULLER INDUSTRIAL PROJECT (KOREA)
11:05～11:20 5.3 The Auto Deprocessor and Power Voltage Sag Protector
Mark K. Choi
Frontier Semiconductor (U.S.A.)
11:20～11:35 5.4 A Transition Delay Test Generation Method for Capture Power Reduction during At-Speed Scan Testing
T. Fukuzawa, K.Miyase, Y.Yamato, H.Furukawa, X.Wen and S.Kajihara
Kyushu Institute of Technology (JAPAN)
11:35～11:50 5.5 KYEC’s Japan Market Strategy -King Yuan Electronics Co., LTD. (KYEC)
Toshio Sugano
King Yuan Electronics Co., LTD. (TAIWAN)
11:50～12:05 5.6 VIETNAM : A New Frontier for Electronics
Hiroyasu Furusho and Seiichi Shikata*
Inoueki Co.,Ltd. and *Sankyu Inc. (JAPAN)
12:05～12:20 5.7 Successful Business Model for Cross-Border Collaboration
P.Bala
FTD Technology PTE Ltd.（Singapore）

12：20～12：45　LUNCH BREAK

12:45～14：45　 Session6 Advanced Packaging Technology
Chair : Jae-Ho Lee (Hongik University)

12:45～13:00 6.1 Properties of Blue Light Emitting Diodes Using PFO-poss
Su-Cheol Gong, Sang-Baie Shin, Ji-Keun Chang, Young-Chul Chang* and Ho-Jung Chang
Dankook University and *Korea University of Technology and Education (KOREA)
13:00～13:15 6.2 Unique IC and LED Packaging Technology
A.OKUNO
SANYU REC CO., LTD. (JAPAN)
13:15～13:30 6.3 The ESC family for Mass Production Flip-Chip Process
Koji Motomura, Seiichi Yoshinaga, Hideki Eifuku, Tadahiko Sakai and Shoji Sakemi
Panasonic Factory Solutions Co., Ltd. (JAPAN)
13:30～13:45 6.4 Laser Saw Development for Low-k Devices
Mutsumi Masumoto
Texas Instruments Japan Limited (JAPAN)
13:45～14:00 6.5 Recent Advancement in Bonding Technology
S. Wickramanayaka
EVGroup Japan KK (JAPAN)
14:00～14:15 6.6 Roll to Roll Printer System for Fine Pitch Patterning on PET Film Roll
Hajime Fukawa
Produce Corp. (JAPAN)
14:15～14:30 6.7 SiP and st-MCP using Chip Stack Technology
David Fang
Powertech Technology Inc. (TAIWAN)
14:30～14:45 6.8 Sn Through-Vias and Their Bumping Structures for Chip Stack Packages
S.K.Kim, M.Y.Kim and T.S.Oh
Hongik University (KOREA)

14:45～15:05 COFFEE BREAK

15：05～16：50　Session7 Substrate and Interconnection Materials
Chair : Yangdo Kim (Pusan National University)

15:05～15: 20 7.1 Directional Sintering in LTCC Substrate
YONG-BIN SUN
Kyonggi University (KOREA)
15:20～15:35 7.2 Newly Developed Halogen-free Materials for Package Substrate
A.Hanawa, T.Kawai, K.Obata, T.Irino and K. Ikeda
Hitachi Chemical Co., Ltd.(JAPAN)
15:35～15:50 7.3 Microstructure Characterization in the Au Stud-Pre-solder Flip Chip Joint
Young-Min Kim, Young-Ho Kim, Woong Sun Lee* and Chul-ho Cho*
Hanyang University and *Hynix Semiconductor Inc. (KOREA)
15:50～16:05 7.4 Newly Developed Isotropic Fabrication of LCP and its Application to Print Circuit Board
S.Okamoto, T.Ito, Y.Kohinata, T.Abe and N.Takahashi
Sumitomo Chemical Co., Ltd. (JAPAN)
16:05～16:20 7.5 The Effects of Bath Compositions on Copper Electroplating for the Defect-free Small Via Filling
Suk-Eui Lee and Jae-Ho Lee
Hongik University (KOREA)
16:20～16:35 7.6 Development of New Acrylic Based Thermal Interface Materials
Takuo Suzuki, Tadahiro Takano and Mamoru Ubukata
Achilles Corporation (JAPAN)
16:35～16:50 7.7 Fabrication of ZnS-SiO2 Sputtering Target and its Properties
Young Do Kim, Gil-Su Kim, Dae-Hoon Shin, Se-Hoon Kim, Hoon Cho*
and Ki-Sung Park**
Hanyang University, *Korea Institute of Industrial Technology and **Vaevac International Co.,Ltd. (KOREA)

17：00～18：30　Session8 Technology Workshop （Poster Session with Wine）
Chair : Daisuke Yamaguchi (ATE Service Corporation)
8.1 Low Temperature Densification of Mo Nanopowder Prepared by Mechanochemical Process
Hai Gon Kim, Gil-Su Kim, Seungho Lee, Young Jung Lee and Young Do Kim
Hanyang University (KOREA)
8.2 Densification of W-Cu Nanocomposite Powder Prepared by Mechanochemical Process
Seungho Lee, Se-Hoon Kim, Young Jung Lee, Young Ik Seo and Young Do Kim
Hanyang University (KOREA)

●Friday, 12 October, 2007
Excursion
8：00　Kokura Station
AM　Sumitomo Metal Electronics Devices Inc.（Yamaguchi Pref.）
PM　MAZDA（Hiroshima Pref.）
17:00頃　Hiroshima Station
21:00頃　Kokura Station

※Participants of Excursion is less than 70 people ( in order of registration).

■Advanced Materials ＆ Substrate Zone
Plubber Tech　(KOREA)
SELASTAR Corp.　(JAPAN)
Sumitomo Chemical Co., Ltd.　 (JAPAN)
ZEON LOGISTICAL MATERIALS CO.,LTD.　 (JAPAN)
Nippon Steel Chemical Co.,Ltd.　 (JAPAN)
THE FURUKAWA ELECTRIC CO.,LTD.　 (JAPAN)
HIRAI SEIMITSU KOGYO CORPORATION　(JAPAN)
Panasonic Factory Solutions Co.,Ltd.　 (JAPAN)
WALTS CO.,LTD.　 (JAPAN)
IBITECH Co.,Ltd.　 (JAPAN)
Wabo Electoronics Co.,Ltd. 　 (JAPAN)
MALCOM CO., LTD.　 (JAPAN)
Senju Metal Industry Co.,Ltd.　 (JAPAN)
PROCESS LAB. MICRON Co.,Ltd.　 (JAPAN)

■Design & Simulation Zone
SiM24 Co.,Ltd.　 (JAPAN)
Marubeni Infoｒmation Systems Co.,Ltd.　 (JAPAN)
Fluent Asia Pacific Co.,Ltd.　 (JAPAN)
U-Tec-System corporation　(JAPAN)
Nagase Electronic Equipment Service Co.,Ltd.　 (JAPAN)
Optimal Corporation Japan　(JAPAN)

■Equipment & Parts Zone
Hanyang University　(KOREA)
Epuller Industrial Project　(KOREA)
TANAKA CORPORATION　(JAPAN)
Mechatro Japan Co.,Ltd,　 (JAPAN)
Toray Engineering Co.,Ltd.　 (JAPAN)
Hitachi High-Technologies Corporation.　 (JAPAN)
Achilles Corporation　(JAPAN)
INTERTEC CORP.　 (JAPAN)
Fukuden Shizai Co., Ltd.　 (JAPAN)
Frontier Semiconductor　(U.S.A.)
DAE A METAL　(KOREA)
Produce Co.,Ltd.　 (JAPAN)
Advantest Kyushu Systems Co.,Ltd.　 (JAPAN)
SAWA CORPORATION　(JAPAN)
Yamaha Motor Co., Ltd.　 (JAPAN)
SAKURAI SEIGI Co.,Ltd.　 (JAPAN)
DISCO Corporation　(JAPAN)

■Semiconductor Device Process
KST World Corp.　 (JAPAN)
Hitachi ULSI Systems Co.,Ltd.　 (JAPAN)
Toshiba Corporation Semiconductor Company　(JAPAN)
EV Group Japan K.K.　 (JAPAN)
Fukuryo Semiconductor Engineering Corporation　(JAPAN)
Sungrim Hitech　(KOREA)

■Organization
Beijing Semiconductor Industry Association　(CHINA)
Malaysian Industrial Development Authority　(MALAYSIA)
The Organization for the East Asia Economic Development(OEAED)　(JAPAN)