July 22, 2005
Previous Participants
China:
Auto Instrument, Dalian Daxian, EASTCOM , HAIER, Hangzhou Hi-Tech Zone Modem Tele-industrial Park, HISENSE, Kengoo Group, KONGYUE Electronics & Information Industry, Toec Technology, SMIC, Tianjin Global Magnetic Card, Tianjin Zhonghuan Semiconductor, Yantai Kingwell Technology,
KOREA:
Genitech, KAIST, Korea Materials & Analysis, KOREA MD COM, M.D. Excimer, MEMS ware, SAMSUNG, Samsung Electro-Mechanics, Shinwon Tech, TELEPHUS,
TAIWAN:
Digitimes, MEGIC
MALAYSIA:
AKTY Technologies, BIM Technologies, MIDA
THAI:
Thai NJR
SINGAPORE:
Institute of Microelectronics
U.S.A:
Microtec Laboratories, President Control System
JAPAN:
Advantest Inc., ALDETE Corporation, Aska Corporation Co., Ltd., Atomnics Laboratory Inc., BOSE Psycho Physics Research Inc., D-Clue Technologies Inc., ELIA Co., Ltd., EXCEL TECHNOLOGY JAPAN K.K., Fukuryo Semicon Engineering Co., Ltd., Gaio Technology Co., Ltd., Hano Seisakusho Co. Ltd., Hanwa Electronics Industry Co., Ltd., Harima Chemicals Inc., Hayashi Co., Ltd., Hara Seiki Industry Co., Ltd., Hioki Electric Equipment Co., Ltd., Hiji Hitec Co., Ltd., Hirai Seimitsu Kogyo Corporation, Hitachi Chemical Co., Ltd., Hitachi ULSI Systems Co., Ltd., iSupply Corporation, INOUEKI Co., Ltd., Interconnection Technologies Co., Ltd., Japan air Gases Co., Ltd., Japan UNIX Co., Ltd., Jedat Innovation Inc., JEOL Ltd., JM Net Inc., Kyoritsu Elex Co., Ltd., Kyushu Nissho Co., Ltd., Kyushu Mitsumi Co., Ltd., Matsushita Electronics Co., Ltd., MALCOM Co., Ltd., Marubun Co., Ltd., Mitsubishi Electric Co., Ltd., Miyazaki Oki Electric Industry Co., Ltd., Meico Denshi Co., Ltd., Meltex Inc., Moldflow Japan K.K., NEC Electronics Co., Ltd., Okabe Mica Co., Ltd., Okuma Electronic Co., Ltd., Panasonic Factory Solutions Co., Ltd., Possible Hearts Inc., Renesas Technology Co., Ltd., Renesas Kyushu Semiconductor Co., Ltd., Rix Co., Ltd., RS Components K.K., Saga Electronics Co., Ltd., Sakurai Seigi Co., Ltd., Senjyu Metal Industry Co., Ltd., Shinryo Electronic Industry Co., Ltd., Sony Semiconductor Kyushu Co., Ltd., Syswave Co., Ltd., Takeda Sangyo Co., Ltd., TAMURA Corporation, Tanaka Corporation, Toshiba LSI Packaging Solution Co., Ltd., Toshiba Corporation Semiconductor Company, Toshiba Ceramics Co., Ltd., TOTO LTD., Toppan Technical Design Center Co., Ltd., Ueno SeikiCo., Ltd., Seiko C & E Co., Ltd., Ulvac Kyushu Co., Ltd., Wavecom Co., Ltd., Yaskawa Electric Co., Ltd., Yamada Denon Co., Ltd., Yokogawa Electric Co., Ltd., Yoshimi Electronics Co., Ltd.
Posted by MAP&RTS2005Q : 10:43 PM
Previous MAP&RTS
Previous MAP & RTS Workshops
The 1st Conference 26-28 Nov. 2001
Theme of Conference: "Management of Technology Mixing"
Key Speakers: Colley Hwang, President, Digitimes Publication Inc. (TAIWAN)
Hatsumi Hamada, General Manager Research & Strategic Planning Department, SONY Corporation Semiconductor Network Company (JAPAN)
Number of Participants: 250
The 2nd Conference 25-27 Nov. 2002
Theme of Conference: "How about China?" "What is Kyushu’s technology Strength?"
Key Speakers: Ih-Chin Chen, Vice President, SMIC (CHINA)
Yoshihisa Toyosaki, President, iSuppli Corporation (JAPAN)
Number of Participants: 250
The 3rd Conference 11-12 Nov. 2003 (The 1st RTS Exhibition)
Theme of Conference: "Technology Matching between Asian Application Company and Semiconductor Company in Kyushu"
Key Speakers: Akio Takeuchi, President, SONY Semiconductor Kyushu (JAPAN)
Dong-Lim Kim, General Manager, Electronics Parts Team, Procurement Center, SAMSUNG Japan (JAPAN)
Junshi Yamaguchi, Senior Vice President, Corporate Operation, NEC Electronics (JAPAN)
Ramli Othman, Director, Electronic Industries Division , MIDA (MALAYSIA)
Zhenyu Shi, R&D Promotion Division, HAIER (CHINA)
Number of Participants: 210
The 4th Conference 17-19 Nov. 2004 (The 2nd RTS Exhibition)
Theme of Conference: "Management of Semiconductor Technology (MOST)" "Semiconductor Module Business "
Key Speakers: Eisaku Ohtsuru, SGM, Procurement Division Manager, SONY Semiconductor Kyushu (JAPAN)
Hideyuki Nishida, Principal Eng., R&D Sdv. Tech. Team, SAMSUNG Electro-Mechanics (KOREA)
Hisato Ishibashi, Manager, Administration Department, THAI NJR (THAILAND)
Kazuo Nakamura, General Manager, Device SI Division, NEC Electronics (JAPAN)
Norio Kubo, General Manager, SOC Dept. Yokogawa Electric Corporation (JAPAN)
Susumu Kohyama, President, Toshiba Ceramics (JAPAN)
Number of Participants: 220
Posted by MAP&RTS2005Q : 08:56 PM