November 01, 2006
Thank you for your coming.
Thank you for your attendance and active participation at the 6th International Workshop on
Microelectronics Assembling and Packaging (MAP) in Fukuoka!
We hope to see you at the next MAP!!
More photos will be updated later.
Posted by MAP&RTS2005Q : 07:08 PM
October 30, 2006
Outline of the Workshop
You can see the movie of Dr. Tomokage's greeting.
http://www.svpmail.jp/stm/
Dates: Monday, October 30 to Wednesday, November 1, 2006
Venue: JAL Resort Sea Hawk Hotel Fukuoka, Fukuoka, Japan
Organizers:
MAP2006 Organizing Committee
Japan Electronics and Information Technology Industries Association (JEITA)
Japan External Trade Organization (JETRO)
Fukuoka Prefecture
City of Fukuoka
City of Kitakyushu
Fukuoka Industry, Science & Technology Foundation (Fukuoka IST)
Promotion Council of Northan Kyushu Science Cities' Development Plan
Kyushu Economy International (KEI)
Kyushu Economic Research Center (KERC)
Posted by MAP&RTS2005Q : 06:44 PM
October 24, 2006
Presentation Schedule (CONFIRMED)
We will announce ｔthat the schedule of Techncal Presentation is CONFIRMED.
For more details, see the PDF file.
MONDAY 30 October
13:00～13:10 Opening Remark
13:00～14:45 Session1 Invited Talks
14:45～15:00 Coffee Break
15:00～16:00 Session2 System in a Package and Device Embedded Technology
16:00～16:20 Coffee Break
16:20～17:40 Session3 Wafer Level Processing
18:00～20:00 Reception Party
TUESDAY 31 October
09:00～10:20 Session4 Advanced Materials and Package
10:20～10:40 Coffee Break
10:40～12:00 Session5 MEMS and Fine Interconnection
12:30～14:00 Lunch Break
14:00～15:00 Session6 Analysis and Inspection Equipment
15:00～15:20 Coffee Break
15:20～17:00 Session7 System Integration Technology
17:00～19:00 Session8 Poster Presentation with wines
For more details, see the PDF file.
Posted by MAP&RTS2005Q : 02:47 PM
October 13, 2006
Notice
“International Semiconductor Technology Joint Forum in Kyushu.”
Take-off from Kyushu
Kyushu Semiconductor Industries & Technology Innovation Association will hold a Forum in Saga to seek technologies and business strategies which semiconductor related industries in the Kyushu area should develop.
Date:Wednesday November 1 and Thursday November 2, 2006
For more details, see the PDF file or website.
Posted by MAP&RTS2005Q : 03:25 PM
October 02, 2006
Accomodation
JAL Resort Sea Hawk Hotel Fukuoka set the discount plan for MAP2006 participants.
For more details on accommodation reservations, please contact directly the hotel.
Here you can see an Accomodation Form on JAL Resort Sea Hawk Hotel Fukuoka.
JAL Resort Sea Hawk Hotel Fukuoka,
Person In Charge: Mr. Iwase
TEL:+81-92-844-7902, FAX:+81-92-844-7743
e-mail:iwase-tatsuro@hawkstown.jp
Posted by MAP&RTS2005Q : 03:34 PM
Poster Session Exhibitor List
We will show you Poster Session Exhibitor List. This is a temporary one, so we will update it.
For more details, see the PDF file.
"Design and Simulation" Zone
FLUENT ASIA PACIFIC CO.,LTD. JAPAN Simulation Tool
NAGASE ELECTRONIC EQUIPMENT SERVICE CO.,LTD. JAPAN LSI Design Tool, Simulation Tool, DFMIT Design for Manufacturing and Integrative Technology
Moldflow Japan K.K. JAPAN Moldflow Plastics Insight
TOPPAN PRINTING CO.,LTD. JAPAN LSI Design, Trial Production Service of LSI
"Wafer Process" Zone
TOSHIBA CORPORATION Semiconductor Company JAPAN IDM, Foundry, Packaging , Testing
Renesas Technology Corp. JAPAN IDM，Next Generation SiP (Si via forming)
Semiconductor Manufacturing International Corp. SMIC CHINA Foundry, Wafer Process
"Assembling and Test Process" Zone
Renesas Kyushu Semiconductor Corp. JAPAN Packaging and Testing House, EMS
STK TECHNOLOGY CO.,LTD. JAPAN Testing, Test House
FUKURYO SEMICON ENGINEERING CORPORATION JAPAN Analysis for LSI, Advanced Analysis Technology Supporting SiP
King Yuan Electronics Co., Ltd. KYEC TAIWAN Testing, Test House
ALLVIA U.S.A. Packaging House, Cooper Plating Techniques For Through Wafer Vias
"Equipment for Inspection" Zone
Kyushu Institute of Technology JAPAN Univ., Inspection Equipment for Semiconducter Devise
Marubun Corporation JAPAN Agent, Inspection Equipment
MORITANI & CO.,LTD JAPAN Agent, Equipment, Ion Migration Testing Systems
SELASTAR Corp. / Technosem JAPAN Agent, Long Life Contact Probe (Twist Probe, Re-Test Free)
Fronter Semiconductor Manufacturing U.S.A. Equipment, Metrology Tool for BEOL
"Equipment for Manufacturing" Zone
Produce Co.,Ltd. JAPAN Equipment, Manufacture of Electronic Roll Printers
INTERTEC CORP. JAPAN Agent, Equipment
SAWA CORPORATION JAPAN Equipment, Metal Mask Washing Machine
SHIBUYA KOGYO CO.,LTD. JAPAN Equipment for Ball Mounter and FC Bonder
"Advanced Materials" Zone
SENJU METAL INDUSTRY Co.,LTD. JAPAN Material, Pn Free Solder for Semiconductor PKG
PROCESS LAB. MICRON Co.,Ltd JAPAN Material, Metal Mask for Semiconductor Devise
MALCOM Co.,Ltd. JAPAN Equipment, Reflow Machine for Cell Production System, Reflow Simulator
ACHILLES CORPORATION JAPAN Agent, Material, Wafer Package System, Conductive materials, non-electrified plastics, color conductive mattresses, electrification-resistant painting
Hitachi Chemical JAPAN New Material for PKG Substrate
Hanyang University KOREA Univ., Spark Plasma Sintering of ZnS-SiO2 Sputtering
Oak-Mitsui Technologies U.S.A. Material, Material for Embedded Capacitor
Okmetic FIINLAND Material, Silicon Wafer Solution for MEMS
"Substrate and Manufacturing Service" Zone
IBITECH CO.,LTD. JAPAN PCB, Interposer, Design and Trial Production Service for Interposer
Wabo Electronics JAPAN PCB, Design and product of precision PCBs, OEM
HITACHI ULSI Systems Co.,Ltd. JAPAN PCB, Design, JISSO Solutions
KOA CORPORATION JAPAN Interposer, PCB, LTCC
Oki Printed Circuits Co.,Ltd JAPAN PWB for Inspection and Testing for Semiconductor Device
SANYO Co.,Ltd. JAPAN Agent, Precision FPC
Hirai JAPAN LTCC Substrate (Low Temperature Cofired Ceramic, Malutilayer Substrate, Various Material Ething parts, Surface Treetment
Imbera FINLAND PCB, Embedding Discrete Components inside PCB Structure
For more details, see the PDF file.
Posted by MAP&RTS2005Q : 02:34 PM
May 10, 2006
Topics to be discussed for MAP2006 are ...
For MAP2006, the main theme will be MEMS, Sensor, three-dimensional packaging simulation technology and design for manufacturability (DFM).
Other topics to be discussed are
◆Technologies of System in a package (SiP), chip scale package (CSP)
◆Technology for Equipments and manufacturing processes of SiP, CSP and wafer level processing
◆Technologies for Printed circuit board (PCB), substrate and interposer
◆Precision parts and module fabrication technology
◆Die attach and interconnection technology
◆Plating, molding and encapsulation technology
◆Soldering, bumping and bonding technology
◆Testing and characterization technology
◆New environment-friendly materials
◆Total manufacturing and process integration
Posted by MAP&RTS2005Q : 11:32 AM
May 09, 2006
Previous MAP&RTS
Previous MAP & RTS Workshops
●The1st Conference Nov 26-28, 2001
Theme of Conference: "Management of Technology Mixing"
Key Speakers: Colley Hwang, President, Digitimes Publication Inc. (TAIWAN)
Hatsumi Hamada, General Manager Research & Strategic Planning Department, SONY Corporation Semiconducter Network Company (JAPAN)
Number of Participants: 250
●The 2nd Conference Nov 25-27, 2002
Theme of Conference: "How about China?"
"What is Kyushu’s technology Strength?"
Title of Invited Talks: Ih-Chin Chen, Vice President, SMIC (CHINA)
Yoshihisa Toyosaki, President, iSuppli Corporation (JAPAN)
Number of Participants: 250
●The 3rd Conference Nov 11-12, 2003 (The first RTS Exhibition)
Theme of Conference: "Technology Matching between Asian Application Company and Semiconductor Company in Kyushu"
Title of Invited Talks: Akio Takeuchi, President, SONY Semiconductor Kyushu (JAPAN)
Dong-Lim Kim, General Manager, Electronics Parts Team, Procurement Center, SAMSUNG Japan (JAPAN)
Junshi Yamaguchi, Senior Vice President, NEC Electronics (JAPAN)
Ramli Othman, Director, Electronics Industries Division, MIDA (MALAYSIA)
Zhenyu Shi, R&D Division, HAIER (CHINA)
Number of Participants: 210
●The 4th Conference Nov 17-19, 2004 (The second RTS Exhibition)
Theme of Conference: "Management of Semiconductor Technology (MOST)"
"Semiconductor Module Business "
Title of Invited Talks: Eisaku Ohtsuru, SGM, Procurement Division Manager, SONY Semiconductor Kyushu (JAPAN)
Hideyuki Nishida, Principal Eng., R&D Sdv. Tech. Team, SAMSUNG Electro Mechanics (KOREA)
Hisato Ishibashi, Manager, Administration Department, Thai NJR (THAILAND)
Kazuto Nakamura, General Manager, Device SI Division, NEC Electronics (JAPAN)
Nirio Kubo, General Manager, SOC Dept., Yokogawa Electric Corporation (JAPAN)
Susumu Kohyama, President, Toshiba Ceramics (JAPAN)
Number of Participants: 220
●The 5th Conference Sep 17-19, 2005 (The Third RTS Exhibition)
Theme of Conference: "The future and Demand for LSI for Automobile Industry"
"Technology Trend: Package on Package (PoP), Testing, Evaluation, Substrate"
Title of Invited Talks: Jeff Shie, Marketing Sales, Episil Technology (TAIWAN)
Joseph Dowd, Founder, Silicon Pipe (U.S.A.)
Jun Taniguchi, Manager, CSP Product, Amkor Technology Japan (JAPAN)
Michio Sato, Assist. Dept. Manager, Automotive FAE Technology Dept., Freescale Semiconductor Japan (JAPAN)
Morihiro Kada, Assistant Department General Manager, Advanced Technology Development Center, Sharp Corporation (JAPAN)
Shuichi Otsuka, President, Hiroshima Elpida Memory (JAPAN)
Yusuke Yamamoto, Staff Engineer, Products Plannig Group, Panasonic Factory Solutions (JAPAN)
Number of Participants: 445
Posted by MAP&RTS2005Q : 11:36 AM
Previous Participants
CHINA: Auto Instrument, Dalian Daxian, EASTCOM, HAIER, Hangzhou Hi-Tech Zone Modem Tele-industrial Park, HISENSE, Hong Kong Science and Technology Parks Corporation, Kengoo Group, KONGYUE Electronics & Information Industry, Toec Technology, SMIC, Tianjin Global Magnetic Card, Tianjin Zhonghuan Semiconductor, Yantai Kingwell Technology
KOREA: Amkor Technology Inc., Genitech, KAIST, Korea Materials & Analysis, KOREA MD COM, M.D. Excimer, MEMS ware, SAMSUNG, Samsung Electro-Mechanics, Shinwon Tech, TELEPHUS
TAIWAN: Digitimes, Episil Technology Inc., King Yuan Electronics Co., Ltd. (KYEC), MEGIC
MALAYSIA: AKTY Technologies, BIM Technologies, MIDA
THAI: Thai NJR
SINGAPORE: Institute of Microelectronics, Manufacturing Integration Technology Ltd.
U.S.A: CAD Design Software, Integrated Reliability test System Inc., Microtec Laboratories, Moldflow Corporation, President Control System, Silicon Pipe Inc.
JAPAN: Advantest Inc., AET Japan Inc., ALDETE Corporation, Amkor Technology Japan, Appllowave Corp., Aska Corporation Co., Ltd., ATE Service Corporation Atomnics Laboratory Inc., BOSE Psycho Physics Research Inc., Casio Computer Co., Ltd., Cybernet Systems Co., Ltd., D-Clue Technologies Inc., ELIA Co., Ltd., Elpida Memory Inc., EXCEL TECHNOLOGY JAPAN K.K., Exploitation of Next Generation Co., Ltd., Fluent Asia Pacific Co., Ltd., Freescale Semiconductor Japan Ltd., Fukuryo Semicon Engineering Co., Ltd., Gaio Technology Co., Ltd., Genesis Technology Inc. Hamamatsu Photonics K.K., Hano Seisakusho Co. Ltd., Hanwa Electronics Industry Co., Ltd., Harima Chemicals Inc., HARADA Corporation, Hara Seiki Industry Co., Ltd., Hayashi Co., Ltd., Hioki Electric Equipment Co., Ltd., Hiji Hitec Co., Ltd., Hirai Seimitsu Kogyo Corporation, Hitachi Chemical Co., Ltd., Hitachi ULSI Systems Co., Ltd., IBITECH Co., Ltd., iSupply Corporation, INOUEKI Co., Ltd., Interconnection Technologies Co., Ltd., Japan air Gases Co., Ltd., Japan Circuit Industrial Co., Ltd., Japan UNIX Co., Ltd., Jedat Innovation Inc., JEOL Ltd., JM Net Inc., Keirex Technology Inc., Kyoritsu Elex Co., Ltd., Kyushu Nissho Co., Ltd., Kyushu Mitsumi Co., Ltd., Matsushita Electronics Co., Ltd., MALCOM Co., Ltd., Marubun Co., Ltd., Minami Co., Ltd., Mitsubishi Electric Co., Ltd., Miyazaki Oki Electric Industry Co., Ltd., Meico Denshi Co., Ltd., Meltex Inc., Moldflow Japan K.K., Nagase Electronic Equipment ServiceCo., Ltd., NEC Electronics Co., Ltd., New Japan Radio Co., Ltd., Nihonmicron Ltd., Nikon Corporation Instruments Company, Nikon Instech Co., Ltd., Nippon Graphite Industries, Ltd., Okabe Mica Co., Ltd., Oki Printed Circuits Co., Ltd., Okuma Electronic Co., Ltd., Olympus Corporation, Panasonic Factory Solutions Co., Ltd., Possible Hearts Inc., Renesas Technology Co., Ltd., Renesas Kyushu Semiconductor Co., Ltd., Rix Co., Ltd., RS Components K.K., Saga Electronics Co., Ltd., Sakurai Seigi Co., Ltd., Senjyu Metal Industry Co., Ltd., Sharp Corporation, Shinano Kenshi Co., Ltd., Shinryo Electronic Industry Co., Ltd., Sony Semiconductor Kyushu Co., Ltd., STK Technology Co., Ltd., SUNTEC Corporation, Syswave Co., Ltd., Takeda Sangyo Co., Ltd., TAMURA Corporation, Tanaka Corporation, Tektronix, Inc., Teradyne Inc., Toshiba LSI Packaging Solution Co., Ltd., Toshiba Corporation Semiconductor Company, Toshiba Ceramics Co., Ltd., TOTO LTD., Toppan Technical Design Center Co., Ltd., Ueno SeikiCo., Ltd., Seiko C & E Co., Ltd., Ulvac Kyushu Co., Ltd., Wavecom Co., Ltd., Yaskawa Electric Co., Ltd., Yamada Denon Co., Ltd., Yokogawa Electric Co., Ltd., Yoshimi Electronics Co., Ltd., System Fabrication Technologies Inc.
Posted by MAP&RTS2005Q : 11:27 AM