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October 18, 2007
Thank you for joining MAP&RTS2007!!
We had a great time with you in MAP&RTS2007.
Thank you for joining us!!!!
We hope that we can see you again next year!!!
We will show you the results of MAP&RTS2007 as follows.
RESULTS
◆MAP◆
participants: 448 （from abroad 85）
China 37, Korea 26, Taiwan 6, Malaysia 5,
U.S. 5, HongKong 4, Singapore 2
presentations: 36 （from abroad 12）
Korea 6, Taiwan 2, U.S. 2, China 1,
Singapore 1
◆RTS◆
exhibitors: 45 (from abroad 8)
Korea 5, U.S. 1, China 1, Malaysia 1
Posted by MAP&RTS2005Q : 11:41 AM
October 13, 2007
Outline of MAP&RTS2007
Dates: October 10 to 12, 2007
Venue: West Japan General Exhibition Center, Kitakyushu, Japan
Organizers:
MAP&RTS2007 Organizing Committee
Asia Semiconductor Trading Support Association (ASTSA)
Japan External Trade Organization (JETRO)
Fukuoka Prefecture
City of Fukuoka
City of Kitakyushu
Fukuoka Industry, Science & Technology Foundation (Fukuoka IST)
Promotion Council of Northan Kyushu Science Cities' Development Plan
Kyushu Economy International (KEI)
Kyushu Economic Research Center (KERC)
For more details, see the brochure(PDF), please.
Posted by MAP&RTS2005Q : 09:53 AM
October 01, 2007
Schedule is confirmed ( Presentation and Excursion)
We will show you the program of MAP&RTS2007.
You can see the PDF file.
●Wednesday, 10 October, 2007
Presentation
12：00～ Registration starts
13：00～13：10 Opening Remarks
Hajime Tomokage
Professor, Dept.of Electronics Engr & Computer Sci., Fukuoka University
13：10～14：40 Session1 Invited Talks
Chair : Eddie Ohtsuru (Fukuoka Industry, Science & Technology Foundation)
13:10～13:40 1.1 A short introduction about the status of semiconductor industries in northern China
Zhihua WANG
Institute of microelectronics, Tsinghua University (CHINA)
13:40～14:10 1.2 Development of Evaluation Software for System LSI Collaborating with Chinese University
Hirokazu Tanaka
Hokkaido University (JAPAN)
14:10～14:40 1.3 Tera Probe, new test business partner as value added solution provider
Masahide Ozawa
Tera Probe ,Inc. (JAPAN)
14:40～15:00 COFFEE BREAK
15：00～16：00 Session2 JEITA Program
Chair:Fumiaki Shigeoka (Ueno Seiki Co., Ltd.)
15:00～15:30 2.1 Mobile Products Trend and Requirement to Semiconductor Package
Hiroshi Manita
Casio Computer Co., LTD. (JAPAN)
15:30～16:00 2.2 Challenges of Semiconductor Packaging Technologies to meet the Requirements from Electronics Products -From Japan Jisso Technology Roadmap 2007-
Shoji Uegaki
ASE Marketing & Service Japan Co., Ltd (JAPAN)
16：20～18：00 Session3 ICT Symposium
-Technology for Next Generation Electric Vehicle-
Chair : Hajime Tomokage (Fukuoka University)
16:20～17:00 3.1 Concept and Technology of Next Generation Electric Vehicle (Eliica)
Hiroshi Shimizu
Keio University (JAPAN)
17:00～17:20 3.2 Future Personal Mobility "i-unit"
Makoto Morita
TOYOTA MOTOR CORPORATION (JAPAN)
17:20～17:40 3.3 Technological Requirements for Electric Vehicles and Kyushu
Electric’s Efforts for Their Promotion
S. Murakami,
Kyushu Electric Power Co., Inc. (JAPAN)
17:40～18:00 3.4 Trends for Car Electronics Market and Testing Equipment
Yasunori Yamaguchi
TERADYNE (JAPAN)
18：30～20：30 Reception Party （AIM 3rd floor Flamingo Cafe）
●Thursday, 11 October, 2007
Presentation
09：00～10：15 Session4 Design for Manufacturability
Chair : Joseph Fjelstad (Sillicon Pipe,Inc.)
09:00～09:15 4.1 Jisso technology trends – Why DFM is necessary ?
Kazunori Kato
Advanced Interface Technology Corp. (JAPAN)
09:15～09:30 4.2 DFM System for Final Manufacturing of LSI
Andres Carrasco
Nagase Electronic Equipment Service Co., Ltd. (JAPAN)
09:30～09:45 4.3 An Integrated Design & Analysis Solution for Advanced IC Package
and System-in-Package (SiP) Design
Dave DeMaria
Optimal Corp. (U.S.A.)
09:45～10:00 4.4 Practical Use of Package Virtual Design System (PVDS) in Spansion
Naomi Masuda, Ryota Fukuyama, Kouichi Meguro, Junichi Kasai
Spansion Japan Limited (JAPAN)
10:00～10:15 4.5 Ideal DFM for backend business in Japanese LSI industry
Ichiro Anjo
Akita Elpida Memory Inc. (JAPAN)
10:15～10:35 COFFEE BREAK
10：35～12：20 Session5 Tool, Test and Business Proposal
Chair : Todd Takaki (Inoueki Co.,Ltd.)
10:35～10:50 5.1 EDA Tool for IC Packaging with Three Dimensions Database
Hiroyuki Kataoka, Hidemichi Kawase* and Hajime Tomokage**
HIBIKINO SYSTEM-LAB INC. ,*Keirex Technology and
**Fukuoka University (JAPAN)
10:50～11:05 5.2 Tool’s of Semiconductor
K.H.Cheon
EPULLER INDUSTRIAL PROJECT (KOREA)
11:05～11:20 5.3 The Auto Deprocessor and Power Voltage Sag Protector
Mark K. Choi
Frontier Semiconductor (U.S.A.)
11:20～11:35 5.4 A Transition Delay Test Generation Method for Capture Power Reduction during At-Speed Scan Testing
T. Fukuzawa, K.Miyase, Y.Yamato, H.Furukawa, X.Wen and S.Kajihara
Kyushu Institute of Technology (JAPAN)
11:35～11:50 5.5 KYEC’s Japan Market Strategy -King Yuan Electronics Co., LTD. (KYEC)
Toshio Sugano
King Yuan Electronics Co., LTD. (TAIWAN)
11:50～12:05 5.6 VIETNAM : A New Frontier for Electronics
Hiroyasu Furusho and Seiichi Shikata*
Inoueki Co.,Ltd. and *Sankyu Inc. (JAPAN)
12:05～12:20 5.7 Successful Business Model for Cross-Border Collaboration
P.Bala
FTD Technology PTE Ltd.（Singapore）
12：20～12：45 LUNCH BREAK
12:45～14：45 Session6 Advanced Packaging Technology
Chair : Jae-Ho Lee (Hongik University)
12:45～13:00 6.1 Properties of Blue Light Emitting Diodes Using PFO-poss
Su-Cheol Gong, Sang-Baie Shin, Ji-Keun Chang, Young-Chul Chang* and Ho-Jung Chang
Dankook University and *Korea University of Technology and Education (KOREA)
13:00～13:15 6.2 Unique IC and LED Packaging Technology
A.OKUNO
SANYU REC CO., LTD. (JAPAN)
13:15～13:30 6.3 The ESC family for Mass Production Flip-Chip Process
Koji Motomura, Seiichi Yoshinaga, Hideki Eifuku, Tadahiko Sakai and Shoji Sakemi
Panasonic Factory Solutions Co., Ltd. (JAPAN)
13:30～13:45 6.4 Laser Saw Development for Low-k Devices
Mutsumi Masumoto
Texas Instruments Japan Limited (JAPAN)
13:45～14:00 6.5 Recent Advancement in Bonding Technology
S. Wickramanayaka
EVGroup Japan KK (JAPAN)
14:00～14:15 6.6 Roll to Roll Printer System for Fine Pitch Patterning on PET Film Roll
Hajime Fukawa
Produce Corp. (JAPAN)
14:15～14:30 6.7 SiP and st-MCP using Chip Stack Technology
David Fang
Powertech Technology Inc. (TAIWAN)
14:30～14:45 6.8 Sn Through-Vias and Their Bumping Structures for Chip Stack Packages
S.K.Kim, M.Y.Kim and T.S.Oh
Hongik University (KOREA)
14:45～15:05 COFFEE BREAK
15：05～16：50 Session7 Substrate and Interconnection Materials
Chair : Yangdo Kim (Pusan National University)
15:05～15: 20 7.1 Directional Sintering in LTCC Substrate
YONG-BIN SUN
Kyonggi University (KOREA)
15:20～15:35 7.2 Newly Developed Halogen-free Materials for Package Substrate
A.Hanawa, T.Kawai, K.Obata, T.Irino and K. Ikeda
Hitachi Chemical Co., Ltd.(JAPAN)
15:35～15:50 7.3 Microstructure Characterization in the Au Stud-Pre-solder Flip Chip Joint
Young-Min Kim, Young-Ho Kim, Woong Sun Lee* and Chul-ho Cho*
Hanyang University and *Hynix Semiconductor Inc. (KOREA)
15:50～16:05 7.4 Newly Developed Isotropic Fabrication of LCP and its Application to Print Circuit Board
S.Okamoto, T.Ito, Y.Kohinata, T.Abe and N.Takahashi
Sumitomo Chemical Co., Ltd. (JAPAN)
16:05～16:20 7.5 The Effects of Bath Compositions on Copper Electroplating for the Defect-free Small Via Filling
Suk-Eui Lee and Jae-Ho Lee
Hongik University (KOREA)
16:20～16:35 7.6 Development of New Acrylic Based Thermal Interface Materials
Takuo Suzuki, Tadahiro Takano and Mamoru Ubukata
Achilles Corporation (JAPAN)
16:35～16:50 7.7 Fabrication of ZnS-SiO2 Sputtering Target and its Properties
Young Do Kim, Gil-Su Kim, Dae-Hoon Shin, Se-Hoon Kim, Hoon Cho*
and Ki-Sung Park**
Hanyang University, *Korea Institute of Industrial Technology and **Vaevac International Co.,Ltd. (KOREA)
17：00～18：30 Session8 Technology Workshop （Poster Session with Wine）
Chair : Daisuke Yamaguchi (ATE Service Corporation)
8.1 Low Temperature Densification of Mo Nanopowder Prepared by Mechanochemical Process
Hai Gon Kim, Gil-Su Kim, Seungho Lee, Young Jung Lee and Young Do Kim
Hanyang University (KOREA)
8.2 Densification of W-Cu Nanocomposite Powder Prepared by Mechanochemical Process
Seungho Lee, Se-Hoon Kim, Young Jung Lee, Young Ik Seo and Young Do Kim
Hanyang University (KOREA)
●Friday, 12 October, 2007
Excursion
8：00 Kokura Station
AM Sumitomo Metal Electronics Devices Inc.（Yamaguchi Pref.）
PM MAZDA（Hiroshima Pref.）
17:00頃 Hiroshima Station
21:00頃 Kokura Station
※Participants of Excursion is less than 70 people ( in order of registration).
Posted by MAP&RTS2005Q : 10:05 PM