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August 20, 2005
RTS2005 Exhibitors
You can see Exhibitors of RTS2005.
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Exhibitors include exhibitors of Poster Session.
List of Exhibitors can be downloaded in PDF format.
RTS 2005 Exhibitors (including Exhibitors of Poster Session)
■Design and Fab less Zone
(LSI Design, System Design, Fabless)
Exploitation of Next Generation Co., Ltd. (ENG) (Japan)：
HITACHI ULSI Systems Co., Ltd. (Japan)：
Seireslabs Sdn Bhd (Malaysia)：
Toppan Technical Design Center Co., Ltd. (Japan)
■Simulation Zone
(Design Tool, Simulation Tool)
AET Japan Inc. (Japan)
ATE Service Corporation (Japan)：
Cybernet Systems Co., Ltd. (Japan) ：ANSYS
Fluent Asia Pacific Co., Ltd. (Japan)：epak, Icechip,
Keirex Technology Inc. (Japan)：
Moldflow Japan K.K. (Japan)：Moldflow MPI / Reactive Molding
Nagase Electronics Equipment Service Co., Ltd. (Japan) ：3D CAD system for DFM
■IDM / Foundry Zone
(Wafer Process)
EPISIL Technologies Inc. (Taiwan)：
Powerchip Semiconductor Corporation PSC (Taiwan, Plan)
SAMSUNG Japan (Japan)
Toshiba Corporation Semiconductor Company (Japan)
Toshiba LSI Packaging Solutions Corporation (Japan)：
■Subcon Zone
(Packaging Process, JISSO, Module)
Casio Computer Co., Ltd. (Japan)：
Fukuryo Engineering (Japan)：
Hanwa Electric Ind., Co, Ltd. (Japan)：
Renesas Kyushu Semiconductor Corp. (Japan)：
■Testing Zone
(Wafer Test, Final Test, Test Engineering, Equipment and Material for Testing)
ALDETE Corporation (Japan)：
Apollowave Corporation (Japan)：
Elia Co., Ltd. (Japan)：
Genesis Technology Inc. (Japan, Plan)
King Yuan Electronics Co., Ltd. KYEC (Taiwan)：
STK Technology Co., Ltd. (Japan, Plan)
Tektronix Japan (Japan)
Yokogawa Electric Corporation (Japan)
■PoP Zone
(Package on Package)
Amkor Technology Inc. (Korea)
Panasonic Factory Solutions Corporation PFSC (Japan)
SHARP Corporation (Japan)
Senjyu Metal Industry Co., Ltd. SMIC (Japan)：
■Equipment Zone
(Equipment)
Hamamatsu photonics (Japan)：
Integrated Reliability Test Systems Inc. IRTS (U.S.A)：Highly Accelerated Thermal Shock (HATS) Test System
Manufacturing Integration Technology Ltd. MIT (Singapore)：
Nikon Instech Co., Ltd. (Japan)：
Malcom Co., Ltd.(Japan)：
Shinano Kenshi Co., Ltd.(Japan)：
■Substrate Zone
(Substrate)
Hano Seisakusho Co., Ltd. (Japan)：
Hirai Seimitsu Kogyo Corporation (Japan)：
Ibitec (Japan)： Integration, Consulting, DFM
Japan Circuit IndustrialCo., Ltd. (Japan)：
Nippon Graphite Industry (Japan)：
Nihonｍicron Ltd. (Japan)
Oki Printed Circuit Co., Ltd. (Japan)：
SUNTEC Corporation (Japan)：
■Distributor and Information Zone
(Agent, Distributor, Consultant, Government)
Harada Corporation (Japan)：
Inoueki Co., Ltd. (Japan)：Highly Accelerated Thermal Shock (HATS) Test System
Marubun Corporation (Japan)：
MIDA (Malaysia)
Minami Co., Ltd. (Japan)：
Sino-Japan Microelectronic Industry Center for Incubation (China)：
Posted by MAP&RTS2005Q : 05:13 PM