November 30, 2008
Thank you for joining MAP2008!
We had a great time with you in MAP&RTS2007.
Thank you for joining us!!!!
We hope that we can see you again next year!!!
Posted by MAP&RTS2005Q : 08:33 PM
November 24, 2008
Regarding the place for presentation or exhibition of MAP2008
We are now preparing for MAP2008.
We will tell you about the details of the place or registration.
1.the place for technical presentation
JAL Resort Sea Hawk Hotel Fukuoka, 1st floor
2.the place for poster exhibition
JAL Resort Sea Hawk Hotel Fukuoka, 1st floor
3.Registration
JAL Resort Sea Hawk Hotel Fukuoka, 1st floor
We set the registration desk.
*1: We will hand over booklets of abstracts in exchange with your two name cards.
*2:To participants who haven't finished payment of registration fee, we may confirm the way of payment. Cash will be accepted in the period of MAP2008.
*3:We will start registration at 9:00 AM.
4.the place for reception party ( Wednesday, November 26th)
JAL Resort Sea Hawk Hotel Fukuoka, 5th floor, TINGA TINGA
5.the place for poster session with wine (Thursday, November 27th)
JAL Resort Sea Hawk Hotel Fukuoka, 1st floor
Posted by MAP&RTS2005Q : 12:59 PM
November 17, 2008
MAP2008's program is fixed
MAP2008 will be held from Nov. 26th to 28th.
Since the program of technical presentation is fixed, we will show you the details.
You can see the PDF file.
Please make a on-line registration.
◇The program of technical presentations◇
Thursday 26th, November
12:30 ~ 13:00 Signing Ceremony of Memorandum of Understanding
between ASTSA & ISA
13:00 ~ 13:05 Opening Remark
Hajime Tomokage
Fukuoka University (JAPAN)
13:05 ~ 14:25 Session 1: Invited Talks
13:05 ~ 13:35 1-1 Current and Future Strategy of Indian Semiconductor Industry
Poornima Shenoy
India Semiconductor Association (ISA) (INDIA)
13:35 ~ 14:05 1-2 How Asia ICT Industry Has Transformed : During the Period of Financial Crisis
Colley Hwang
DigiTimes Inc. (TAIWAN)
14:05 ~ 14:25 1-3 Why the profitability of Japan's Major Electric Manufacturers is so Low and Where are
They Going? - The Prospect for the Upcoming Restructuring.
Fumiaki Sato
Merrill Lynch Japan Securities Co., Ltd. (JAPAN)
14:25 ~ 15:00 Coffee Break
15:00 ~ 18:00 Session 2: 3D Integration
(Knowledge Cluster Initiative (The 2nd Stage) Expansion Program, The 4th Workshop)
15:00 ~ 15:30 2-1 Fabrication and Reliability Issues for Through Silicon Via Technologies
Peter Ramm
Fraunhofer IZM (GERMANY)
15:30 ~ 16:00 2-2 Ad-STAC and ITRI`s 3DIC Update
Wei-Chung Lo
Industrial Technology Research Institute (ITRI) (TAIWAN)
16:00 ~ 16:20 Coffee Break
16:20 ~ 16:40 2-3 Development and Production Status on TSV and CoC in Japan
Hirohisa Matsuki
Fujitsu Microelectronics Limited (JAPAN)
Japan Electronics and Information Technology Industries Association (JEITA) (JAPAN)
16:40 ~ 17:00 2-4 Package Warpage at Elevated Temperature
Hirofumi Nakajima
NEC Electronics Corporation (JAPAN)
Japan Electronics and Information Technology Industries Association (JEITA) (JAPAN)
17:00 ~ 17:20 2-5 Google Aided SiP Design Review
Hiroshi Murata
GEM Design Technologies, Inc. (JAPAN)
17:20 ~ 17:40 2-6 Renesas SiP Future 3D Technology
Masashi Umino
RENESAS Technology Corporation. (JAPAN)
17:40 ~ 18:00 2-7 InterViaTM Photodielectric
Wataru Tachikawa
Rohm and Haas Electronic Materials K.K. (JAPAN)
18:00 ~ 18:30 Coffee Break
18:30 ~ 20:00 Reception Party
Thursday 27th, November
09:00 ~ 12:10 Session 3: Green Devices
09:00 ~ 09:30 3-1 Photovoltaic Industry Activities in Korea
Donghan Kim
Korea University (KOREA)
09:30 ~ 10:00 3-2 Introduction to Processes and Prospects of CIGS and Organic Thin Film Solar Cells
Keiichiro Sakurai, Tetsuya Taima
National Institute of Advanced Industrial Science and Technology (AIST) (JAPAN)
10:00 ~ 10:30 3-3 Investment Opportunities in the Solar Industry in Malaysia
Zabidi Mahbar
Malaysian Industrial Development Authority (MIDA) (MALAYSIA)
10:30 ~ 10:40 Coffee Break
10:40 ~ 11:10 3-4 High Bright White LED Packaging Technology and It’s Applications
Atsushi Okuno
Sanyu Rec Co., Ltd. (JAPAN)
11:10 ~ 11:40 3-5 Sapphire and Diamond R&D of Namiki
Kazuhiko Sunagawa
Namki Precision Jewel Co., Ltd. (JAPAN)
11:40 ~ 12:10 3-6 Investment Opportunities in the Solar Industry in Malaysia
Tomomi Yamaguchi
Toshiba Cooperation (JAPAN)
12:10 ~ 13:00 Lunch Break
13:00 ~ 15:50 Session 4: Semiconductor Testing Solution
13:00 ~ 13:20 4-1 Business Model & New Probing Technology
Masahide Ozawa
Tera Probe, Inc. (JAPAN)
13:20 ~ 13:40 4-2 KYEC’s Japan Market Strategy - King Yuan Electronics Co., LTD. (KYEC)
Toshio Sugano
King Yuan Electronics Co., Ltd. (TAIWAN)
13:40 ~ 14:00 4-3 Yokogawa Electric Corporation SoC Tester Strategy
Hirokazu Oooka
Yokogawa Electric Corporation (JAPAN)
14:00 ~ 14:20 4-4 Silicon Netlist to High Volume Production - Opportunities for Time to Market
P. Raj Manickam
Tessolve (INDIA)
14:20 ~ 14:30 Coffee Break
14:30 ~ 14:50 4-5 Chip Defects Inspection System for CIS／MEMS／Flip Chip／Wafer Level CSP
Toshiyuki Yasuda
TOPCON Corporation (JAPAN)
14:50 ~ 15:10 4-6 Chip Test – Semiconductor IC Test Services
M. Sankara
ChipTest Labs Ltd. (INDIA)
15:10 ~ 15:30 4-7 Image Sensor Testing - How to Test for CIS/CCD
Yuji Nakamura
ALDETE Corporation (JAPAN)
15:30 ~ 15:50 4-8 Leadless Molded Packaging
T.Paul Ilanghovan
SPEL Semiconductor Limited. (INDIA)
15:50 ~ 16:05 Coffee Break
16:05 ~ 17:05 Session 5: Design tool and Design Business
16:05 ~ 16:25 5-1 EDA tools for Analog/Mixed-Signal IC and MEMS Layout Design for Circuit Design,
Layout Design and Layout Verification
Yoshiko Shimogaki
Tanner Research Japan K.K. (JAPAN)
16:25 ~ 16:45 5-2 Offshore Outsourcing of LSI Design & Software Development
Joby Joseph V.
Network Systems & Technologies Pte Ltd. (INDIA)
16:45 ~ 17:05 5-3 A Unique 'In-sourcing' Business Model for Offshore Chip-Design and Software
Development Centres
Bala Dhandayuthapani Pachyappa
Auxineon Pte Ltd. (SINGAPORE)
17:05 ~ 17:20 Coffee Break
17:20 ~ 19:00 Session 6: Equipment and Parts
17:20 ~ 17:40 6-1 Molecular Modification of PCB Substrates for Fine Line Patterning: Demonstration of
High Peel Strength, Low Surface Roughness and HAST Survivability of Molecular
Modified Surfaces
Werner Kuhr, Ph.D.
Zetta Core.Inc. (U.S.A.)
17:40 ~ 18:00 6-2 Micro Contact Applied Semiconductor Socket
Shin Yoshida
Alps Electric Co., Ltd. (JAPAN)
18:00 ~ 18:20 6-3 Making Equipment Manufactures More Competitive in the Global Market – the
Introduction of “Monozukuri” at Kitahara Welltec
Kitahara Nobu
Kitahara Welltec, Inc. (JAPAN)
18:20 ~ 18:40 6-4 Factory Automation & Productivity Enhancement
Keiji Matsumoto
Daiichi Institution Industry Co., Ltd. (JAPAN)
18:40 ~ 19:00 6-5 Assembly of Electronics without Solder - Technical Dream or Vision of the Future? Joseph Fjelstad
Verdant Electronics – Silicon Pipe (U.S.A.)
19:00 ~ 20:30 Session 7: Poster Session with Wines
7-1 Electro polishing of Copper for Planarization of TSV in 3D SiP
Jae-ho Lee
Hongik University (KOREA)
Posted by MAP&RTS2005Q : 03:22 PM
November 16, 2008
Outline of MAP2008
Dates: November 26to 28, 2008
Venue: JAL Resort Sea Hawk Hotel Fukuoka, Fukuoka, Japan
Organized by (plan):
MAP&RTS2007 Organizing Committee
Asia Semiconductor Trading Support Association (ASTSA)
Japan External Trade Organization (JETRO)
Kyushu Semiconductor Industries & Technology Innovation Association (SIIQ)
Fukuoka Prefecture
City of Fukuoka
City of Kitakyushu
Fukuoka Industry, Science & Technology Foundation (Fukuoka IST)
Kyushu Economy International (KEI)
Kyushu Economic Research Center (KERC)
For more details, see the brochure(PDF), please.
Posted by MAP&RTS2005Q : 10:29 AM
October 28, 2008
We uproad the latest program of MAP2008
MAP2008's topics are...
*Networking with Indian semiconductor companies
*Analyst shows a scenario of reorganizing semiconductor business
*Green device (solar cell, LED and power device)
*Latest 3D assembling technologies (Fraunhofer IZM, ITRI and IDM)
*Access to the database of 850 semicondutor companies
*Excursion (NEC and Tera Probe in Kumamoto Pref.) in order of request, 30 people
For more details see the latest flyer (PDF)
http://astsa.jp/upload/2008/10/200810281920552.pdf
Online Registration
http://astsa.jp/navi_e_guide.php
Posted by MAP&RTS2005Q : 07:52 PM
October 14, 2008
Program of MAP2008(Plan)
Wed, November 26, 2008
PM
Presentation
●Invited Talks
●Technical Presentation
Poster Exhibition
●Poster Exhibition and Business Meeting
Reception Party
Thu, November 27, 2008
AM-PM
Presentation
●Business Presentation
●Technical Presentation
Poster Exhibition
●Poster Exhibition and Business Meeting
Poster Session with Wine
Fri, November 28, 2008
AM-PM
Excursion
(Semiconductor Companies in Kyushu)
Topics to be discussed are
■Next to Foundry Business
■Indian Semiconductor Trend
■MEMS and Sensor Devices
■Three Dimensional Packaging Technology
■Device-Embedded Substrate
■Design for Manufacturability
■Solar Cell Packaging
■Eco Device and Environment-Friendly Materials
For more details, see the brochure(PDF), please.
Posted by MAP&RTS2005Q : 10:44 AM
September 13, 2008
Registration for MAP2008
Participants for MAP2008 can register either by filling out and faxing the "Registration and Application"form.
●FAX●
The "Registration and Application"form is attached at the end of brochure or online by accessing this page.
You can download the form(PDF) online.
Registration and Application form (English)
Fax number is : +81-92-722-6205
1. MAP2008 Participation
The Registration Fee is 30,000yen per person and includes:
A booklet of Technical Abstracts from all the sessions
Access to a database of over 600 IC related companies in English and Japanese
Entrance to the reception
Excursion of the Semiconductor company in Kitakyushu.(Participants will be selected by registration on a first-come-first-serve basis.Application to excursion is closed.)
The deadline for registration isNovember 25, 2008.
2. Technical Presentation
Participants are welcome to make 15-20 min presentation in English which should be accompanied by 1 page abstract to be submitted by October 17,2008. There will be no additional fee other than the 30,000yen participation fee. The deadline for registration of technical presentation is October 24, 2008.
3. Poster Exhibition
For participants who wish to promote their products through the poster exhibition, a 1.5m x 2m panel will be supplied and the fee will be 98,000yen which includes the participation fee for 1 participant.
The deadline for application is October 31, 2008.
Posted by MAP&RTS2005Q : 09:47 AM
Accomodation
JAL Resort Sea Hawk Hotel Fukuoka set the discount plan for MAP2008 participants.
For more details on accommodation reservations, please contact directly the hotel.
Here you can see an Accomodation Form on JAL Resort Sea Hawk Hotel Fukuoka.
JAL Resort Sea Hawk Hotel Fukuoka,
Person In Charge: Mr. Iwase
TEL:+81-92-844-7902, FAX:+81-92-844-7743
e-mail:iwase-tatsuro@hawkstown.jp
Posted by MAP&RTS2005Q : 08:25 AM
September 12, 2008
Abstract Form for MAP2008
Authors are invited to submit contributions for the topics of MAP2008.
Abstracts should be in double spaced, one page A4 sheet, which will be collected in a booklet. Abstracts will be distributed to the participants at the beginning of workshop. We accept abstracts via standard mail and e-mail.
You can mail to: 1-9-48 Daimyo, Chuo-ku, Fukuoka, 810-0041 JAPAN
Kyushu Economic Research Center
Y.Nakagawa, E.Hirata and H.Okano
You can email to: MAP@astsa.jp
The Deadline is October 17, 2008.
Please follow these guides when you write your abstract.
- Font and size.....................Times New Roman 12 points
- Paper size ..........................A4
- Length .................................No more than 2 pages
Here is the sample format of an abstract. It does not have to be exactly this way, but it will be help us when we edit the abstracts.
Posted by MAP&RTS2005Q : 02:06 PM
October 18, 2007
Thank you for joining MAP&RTS2007!!
We had a great time with you in MAP&RTS2007.
Thank you for joining us!!!!
We hope that we can see you again next year!!!
We will show you the results of MAP&RTS2007 as follows.
RESULTS
◆MAP◆
participants: 448 （from abroad 85）
China 37, Korea 26, Taiwan 6, Malaysia 5,
U.S. 5, HongKong 4, Singapore 2
presentations: 36 （from abroad 12）
Korea 6, Taiwan 2, U.S. 2, China 1,
Singapore 1
◆RTS◆
exhibitors: 45 (from abroad 8)
Korea 5, U.S. 1, China 1, Malaysia 1
Posted by MAP&RTS2005Q : 11:41 AM